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Auto stencil cleaning: Standard Specification,
including Wet wiping, dry wiping and Exhaust the
air.
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Humanity software: Easy to learn and operate.
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Blade working under stencil or depart from
stencil; it will not move up and down; to ensure
the steady of printing.
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Blade tooling with floating blade and device of
constant pressure, it will not influence the
quality when changing the blade.
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Inner part with Multi-steps steps function of
forward boards, could prevent the solder may
touch the board.
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Z axis print platform working fast and steady,
could increase the printing flatness of increase
the printing flatness of pc board.
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The vacuum device is option, available for under
0.6mm board.
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Align system with the multi binary control, and
include the X,Y,θ high precision movement,
ensure the printing fixed accuracy.
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【Application】
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Apply for SMT/Semiconductor Stencil/
Screen printing, also for the solder
paste printing/ glue printing
process.
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Best solution for semiconductor
printing process.
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Repeat printing could achieve to
±10μm. (For 01005 component
requirement.)
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Low cost fully auto printer,
outstanding & high performance
printer in this fields.
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Equipped best resolution CCD vision
alignment system.
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【Operational Vision】
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Diagrammatic window operating page.
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Humanly Operational Environment.
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Easy to learn and use.
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【System Setting】
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Provides the fine tuning revise by diagrammatic
machine.
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Windows Operational Environment: Easy to learn.
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【Printing Mechanism】
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Floating scraper and constant pressure system :
Control the printing pressure accuracy on each
part.
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Inner part with multi-steps function of forward
boards, could prevent the solder may touch the
board.
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Blade working under stencil or depart from
stencil; it will not move up and down; to ensure
the steady of printing.
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【Clean device】
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Auto stencil cleaning : Standard Specification,
including Wet wiping 、Dry wiping and Exhaust the
air.
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To ensure the movement smoothly and reliably,
the auto stencil clean system and CCD device are
separated.
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To ensure the printing and cleaning quality, all
parameters can be set such as clean mode and
clean cycle etc.
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Extra function to strengthen the clean.
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【Clean device】
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CCD vision alignment module : multi binary
control.
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The vacuum device is option, available for under
0.6mm board.
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Programmable and adjustable high-speed PCB
transmission system.
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On-axis light and ring lamp to be used, could
check for different types of PCB board.
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【Pressplate/backup plate】
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Precise clamping system can effectively overcome
the printing accuracy for curved PCB.
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Suitable for most single-side/duplicated and
multi-layer PCB board.
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【Specifications】 Machine Information
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KP510A |
Approx dimension |
1100mm*1400mm*1515mm |
Approx weight |
Approx. 950Kg |
Power supply |
AC 1Ø,220V,50/60HZ;2kw,10A |
Air supply |
Clean dry air 5~6kg/cm2 30L/min |
Operator interface |
Windows interface |
Board Handling
|
KP510A |
Suitable dimension of board |
max:400*310(mm) min:50*50(mm) |
Suitable thickness of board |
0.6~6(mm) |
Board width adjustment |
Auto |
Suitable weights of board |
3kg or less |
Board clamping tooling |
Edge clamp (Could adjust the
softness) |
Print Parameters
|
KP510A |
Screen frames |
max:735*735(mm) min:650*550(mm) |
Print area |
max:400*310(mm) min:50*50(mm) |
Print pressure |
0~5kg/cm2 |
Stencil separation speed |
0.1~5mm/sec (Programmable) |
Print direction |
Front to back/Back to front |
Print speed |
5~250mm/sec |
Vision System
|
KP510A |
CCD camera |
High resolution CCD |
Image process |
Multi binary control |
Fiducials |
2 |
Fiducial size |
0.1mm~3.0mm |
Flducial position |
Any point on PCB |
Fiducial error recovery |
Auto fiducial search |
Machine Capability
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KP510A |
Repeat Precision |
±10μm |
Printing precision |
±20μm |
Cycle Time |
<7.5sec |
Clean function |
Wet wiping/Dry wiping/Vacuum |
Clean dimension |
X:400mm |
Option
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Thimble/ejector bar |
Vacuum holding fixture module |
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【Download】 |
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Catalogue |
KP510A.pdf
(320k) |
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Video |
KP510A |
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Manual |
KP510A.pdf
(320k) |
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<Back > |
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